The project with 16 partners from three countries is working on solutions for new assembly and connection technologies for reliable bendable electronics and met for the second project review at IMS CHIPS in Stuttgart from April 23 to 24.

Technology advances were summarized in presentations by each partner, and the first generation of the Use case demonstrators were shown live.

The European reviewers gave a very positive evaluation of the project after the two-day presentation and emphasized the results as well as the good cooperation within the consortium.