The conference will take place from September the 11th to the 13th  in Berlin, Germany.

Poster, Michael Kübler (IMS CHIPS):
„Development and Characterization of a Chip-Film Patch Interposer Integrating an Ultrathin Electrophysiology Chip“

(Michael Kübler, Alexander Frank, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz)