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Hybrid integrated high performance electronic stripes​

Chip-Film Patch Processing

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Chip-Film Patch Processing

Unique Chip Embedding Technology

ProcessFlow Low: Diagram illustrating the low-level process flow for manufacturing hybrid electronic stripes with high performance.

Specifications of the Chip-Film Patch Fabrication Process

Table

Ultrathin Si Chips

HyPerStripes Wafer
HyPerStripes
HyPerStripes

Applications

Projekt KoSiF
Project: KoSiF
Visual demonstration of Flexcom technology showcasing its features and capabilities in flexible communication solutions.
Project: FFlexCom
Ulrike Passlack

Ulrike Passlack

Institut für Mikroelektronik Stuttgart
Germany
Website
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