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Project HyPerStripes
Technical details
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Home
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Project HyPerStripes
Technical details
Partners
Hybrid integrated high performance electronic stripes
Chip-Film Patch Processing
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Chip-Film Patch Processing
Unique Chip Embedding Technology
Specifications of the Chip-Film Patch Fabrication Process
Ultrathin Si Chips
Applications
Project: KoSiF
Project: FFlexCom
Ulrike Passlack
Institut für Mikroelektronik Stuttgart
Germany
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