The 16 partners of the EU project HyPerStripes (new assembly and interconnection technology for reliable bendable electronics) met at the end of March at OSYPKA AG in Rheinfelden, Germany, for the final project evaluation.

The technological advances were summarized in presentations by each partner, and the final use case demonstrators were shown in live. In addition to the technological aspects, the sustainability of the new manufacturing processes was also assessed.

The European reviewers and the representatives of the national funding organizations were impressed by the results achieved and the excellent cooperation within the consortium. Together, they developed and compared technologies for intelligent, flexible and large-scale electronic systems for five application demonstrators.

Duration of the project: 01/04/2022 – 31/03/2025
National funding: BMBF (16ME0469)
Project Manager: Ulrike Passlack
Contact: passlack[at]ims-chips.de