HyPerStripes – a successful final project review
HyPerStripes – a successful final project review The 16 partners of the EU project HyPerStripes (new assembly and interconnection technology for reliable bendable electronics) met at the end of March at OSYPKA AG in Rheinfelden, Germany, for the final project evaluation. The technological advances were summarized in presentations by each partner, and the final use case demonstrators were shown in live. In addition to the technological aspects, the sustainability of the new manufacturing processes was also assessed. The European reviewers and the representatives of the national funding organizations were impressed by the results achieved and the excellent cooperation within the consortium. Together, they developed and compared technologies for intelligent, flexible and large-scale electronic systems for five application demonstrators. Duration of the project: 01/04/2022 – 31/03/2025National funding: BMBF (16ME0469)Project Manager: Ulrike PasslackContact: passlack[at]ims-chips.de
Xecs Matchmaking Event
Xecs Matchmaking Event The Xecs Matchmaking Event will take place on October 15th in Hamburg, Germany. Our HyPerStripes partners Corne Rentrop (TNO) and Christof Landesberger (Fraunhofer EMFT) will showcase HyPerStripes in a poster presentation and promote our follow-up project. Xecs Matchmaking Event – Xecs Call 4 : Aeneas (aeneas-office.org)
Techblick 2024
Techblick 2024 The conference will take place from October 23th to the 24th in Berlin, Germany. Our HyPerStripes partner, Stefan Bendig from Würth Electronic, will give a presentation on „State of the art of the industrial stretchable PCB and its potential for future development” https://www.techblick.com/electronicsreshaped
IEEE ESTC 2024
IEEE ESTC 2024 The conference will take place from September the 11th to the 13th in Berlin, Germany. Poster, Michael Kübler (IMS CHIPS):„Development and Characterization of a Chip-Film Patch Interposer Integrating an Ultrathin Electrophysiology Chip“ (Michael Kübler, Alexander Frank, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz) https://www.estc-conference.net/
6th IFETC Conference
6th IFETC Conference The 6th IFETC conference will take place from September 15th to the 18th in Bologna, Italy. Our HyPerStripes partner, Nico Arnold from the University Dresden (TUD), Germany will give a presentation on „Designing Flexible Electronics Using Open-Source Software“. IFETC 2024 – International flexible electronics technology conference 2024
The HyPerStripes Project – Successful Second Year Evaluation
The HyPerStripes Project – Successful Second Year Evaluation The project with 16 partners from three countries is working on solutions for new assembly and connection technologies for reliable bendable electronics and met for the second project review at IMS CHIPS in Stuttgart from April 23 to 24. Technology advances were summarized in presentations by each partner, and the first generation of the Use case demonstrators were shown live. The European reviewers gave a very positive evaluation of the project after the two-day presentation and emphasized the results as well as the good cooperation within the consortium.
Clusterconference MicroTEC SW
Clusterconference MicroTEC SW The conference will take place from April the 16th to the April 17th in Freiburg, Germany. Lecture, Ulrike Passlack (IMS CHIPS):„Intelligent Systems for Medical Applications – Technologies and Applications of Flexible Sensors“ (Ulrike Passlack, Michael Kübler, Christine Harendt, Joachim N. Burghartz) https://www.microtec-suedwest.de/en/news-termine/clusterkonferenz/archiv-clusterkonferenzen/ck-24
VMAP User Meeting 2024
VMAP User Meeting 2024 Date: 14-15 February at Birlinghoven, Sankt Augustin, Germany Our HyPerStripes partner, Nico Arnold from TU Dresden, will give a presentation on „Integrated design process for flexible electronics using VMAP“. https://www.vmap-standard.org/Events/VMAP-User-Meeting-2024/
MikroSystemTechnik Kongress 2023
MikroSystemTechnik Kongress 2023 The MikroSystemTechnik Kongress will be held in Dresden from Oktober 23th thru Oktober 25th, 2023. Lecture, Ulrike Paslack (IMS CHIPS) Wednesday, 25.10.2023 C5 Aufbau- und Verbindungstechnik, room 2, 13:40 Innovative Fabrication of Polymer-Based Sensor Systems by Flip-Chip Integration of Ultrathin Chips Using Nanowires for Medical ApplicationsUlrike Passlack, Björn Albrecht, Christine Harendt (Institut für Mikroelektronik Stuttgart (IMS CHIPS), Germany); Florian Weißenborn, Olav Birlem, Sebastian Quednau (NanoWired GmbH, Germany); Joachim Burghartz (Institut für Mikroelektronik Stuttgart, Germany) https://www.mikrosystemtechnik-kongress.de/de
Review meeting
Review meeting 16. – 17. of March 2023 in Eindhoven, TNO The 16 HyPerStripes partner met at Holst Center in Einhoven and had a very successful meeting and project review at the end of the first project year. In general, the reviewers, the present national representatives and the representative of AENEAS complimented the good interactions between the partners and the progress in the project. The shown presentations gave a good summary about the state of the project and all required information were shown.
